Verwandte Artikel zu Multichip Modules and Related Technologies: McM, Tab,...
Multichip Modules and Related Technologies: McM, Tab, and Cob Design (Electronic Packaging and Interconnection Series) - Hardcover
Inhaltsangabe
Surface mount technology (SMT) revolutionized the electronic packaging field in the 80s. Now - while many manufacturers are still rushing to retool for SMT - three new technologies are taking the industry by storm: multichip module (MCM), tape automated bonding (TAB), and chip on board (COB) packaging. Capable of producing results that are 50% lighter, 50% smaller, and 50% cheaper than SMT, these leading-edge technologies are bound to have an enormous impact on a broad spectrum of applications - from aerospace and communications to advanced computer and control technologies. Providing complete coverage of all design and manufacturing issues as well as end-product applications, this book shows how to take part in the packaging revolution of the 90s.
Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.
Suchergebnisse für Multichip Modules and Related Technologies: McM, Tab,...
Foto des Verkäufers
Multichip Modules and Related Technologies: McM, Tab, and Cob Design (Electronic Packaging and Interconnection Series)
Anbieter: -OnTimeBooks-, Phoenix, AZ, USA
Verkäuferbewertung 5 von 5 Sternen
Zustand: good. A copy that has been read, remains in good condition. All pages are intact, and the cover is intact. The spine and cover show signs of wear. Pages can include notes and highlighting and show signs of wear, and the copy can include "From the library of" labels or previous owner inscriptions. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item! Ships via media mail. Bestandsnummer des Verkäufers OTV.007023552X.G
Gebraucht kaufen
EUR 43,11
Versand gratis
Versand innerhalb von USA
Versand innerhalb von USA
Anzahl: 1 verfügbar