Inhaltsangabe
This reference work provides data and design guidelines for all major types of active components, including memory devices, gate and logic arrays, microprocessors, ASICs, integrated circuits, and semiconductors. This edition contains a new topic - microwave and electro-optic components.
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Über die Autorin bzw. den Autor
Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronics industry. He is a graduate of The John Hopkins University School of Engineering , Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.
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Active Electronic Component Handbook
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