The most complete, current guide to semiconductor processing Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors. State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry. COVERAGE INCLUDES: The semiconductor industry Properties of semiconductor materials and chemicals Crystal growth and silicon wafer preparation Wafer fabrication and packaging Contamination control Productivity and process yields Oxidation The ten-step patterning process--surface preparation to exposure; developing to final inspection Next generation lithography Doping Layer deposition Metallization Process and device evaluation The business of wafer fabrication Devices and integrated circuit formation Integrated circuits Packaging
Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.
Peter Van Zant is the Principal of Peter Van Zant Associates, a semiconductor manufacturing consulting and training company, and the author of all three previous editions of this widely read book. He has over 35 years in the semiconductor industry, working at IBM, Texas Instruments, and National Semiconductors. He resides in Grass Valley, California.
„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.
Anbieter: Sizzler Texts, SAN GABRIEL, CA, USA
Soft cover. Zustand: New. Zustand des Schutzumschlags: New. International Edition. **INTERNATIONAL EDITION** Read carefully before purchase: This book is the international edition in mint condition with the different ISBN and book cover design, the major content is printed in full English as same as the original North American edition. The book printed in black and white, generally send in twenty-four hours after the order confirmed. All shipments go through via USPS/UPS/DHL with tracking numbers. Great professional textbook selling experience and expedite shipping service. Bestandsnummer des Verkäufers ABE-14799751152
Anzahl: Mehr als 20 verfügbar
Anbieter: Aideo Books, San Marino, CA, USA
Trade paperback. Zustand: New in new dust jacket. 6th Revised ed. INTERNATIONAL EDITION. ***INTERNATIONAL EDITION*** Read carefully before purchase: This book is the international edition in mint condition with the different ISBN and book cover design, the major content is printed in full English as same as the original North American edition. The book printed in black and white, generally send in twenty-four hours after the order confirmed. All shipments contain tracking numbers. Great professional textbook selling experience and expedite shipping service. Glued binding. Paper over boards. 548 p. Contains: Illustrations, black & white, Figures. Audience: General/trade. Bestandsnummer des Verkäufers K0080000970
Anzahl: Mehr als 20 verfügbar
Anbieter: GreatBookPrices, Columbia, MD, USA
Zustand: New. Bestandsnummer des Verkäufers 19540250-n
Anzahl: Mehr als 20 verfügbar
Anbieter: California Books, Miami, FL, USA
Zustand: New. Bestandsnummer des Verkäufers I-9780071821018
Anzahl: Mehr als 20 verfügbar
Anbieter: GreatBookPrices, Columbia, MD, USA
Zustand: As New. Unread book in perfect condition. Bestandsnummer des Verkäufers 19540250
Anzahl: Mehr als 20 verfügbar
Anbieter: Rarewaves USA, OSWEGO, IL, USA
Hardback. Zustand: New. Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.The most complete, current guide to semiconductor processingFully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors.State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry.COVERAGE INCLUDES:The semiconductor industryProperties of semiconductor materials and chemicalsCrystal growth and silicon wafer preparationWafer fabrication and packagingContamination controlProductivity and process yieldsOxidationThe ten-step patterning process--surface preparation to exposure; developing to final inspectionNext generation lithographyDopingLayer depositionMetallizationProcess and device evaluationThe business of wafer fabricationDevices and integrated circuit formationIntegrated circuitsPackaging. Bestandsnummer des Verkäufers LU-9780071821018
Anzahl: Mehr als 20 verfügbar
Anbieter: GreatBookPricesUK, Woodford Green, Vereinigtes Königreich
Zustand: New. Bestandsnummer des Verkäufers 19540250-n
Anzahl: Mehr als 20 verfügbar
Anbieter: GreatBookPricesUK, Woodford Green, Vereinigtes Königreich
Zustand: As New. Unread book in perfect condition. Bestandsnummer des Verkäufers 19540250
Anzahl: Mehr als 20 verfügbar
Anbieter: Chiron Media, Wallingford, Vereinigtes Königreich
Hardcover. Zustand: New. Bestandsnummer des Verkäufers 6666-ING-9780071821018
Anzahl: Mehr als 20 verfügbar
Anbieter: moluna, Greven, Deutschland
Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Fully revised to cover the latest advances in the field, this new edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. Detailed illustrations and real-world example. Bestandsnummer des Verkäufers 5888395
Anzahl: Mehr als 20 verfügbar