Excerpt from Methods of Measurement for Semiconductor Materials, Process Control, and Devices: Quarterly Report, July 1 to September 30, 1971
The report of each task includes the long - term objective, a narra tive description of progress made during this reporting period, and a listing of plans for the immediate future. Additional information con cerning the material reported may be obtained directly from individual staff members connected with the task as indicated throughout the report. The organization of the Joint Program staff and telephone numbers are listed in Appendix A.
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This book is a reproduction of an important historical work. Forgotten Books uses state-of-the-art technology to digitally reconstruct the work, preserving the original format whilst repairing imperfections present in the aged copy. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in our edition. We do, however, repair the vast majority of imperfections successfully; any imperfections that remain are intentionally left to preserve the state of such historical works.
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Excerpt from Methods of Measurement for Semiconductor Materials, Process Control, and Devices: Quarterly Report, July 1 to September 30, 1971
The report of each task includes the long - term objective, a narra tive description of progress made during this reporting period, and a listing of plans for the immediate future. Additional information con cerning the material reported may be obtained directly from individual staff members connected with the task as indicated throughout the report. The organization of the Joint Program staff and telephone numbers are listed in Appendix A.
About the Publisher
Forgotten Books publishes hundreds of thousands of rare and classic books. Find more at www.forgottenbooks.com
This book is a reproduction of an important historical work. Forgotten Books uses state-of-the-art technology to digitally reconstruct the work, preserving the original format whilst repairing imperfections present in the aged copy. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in our edition. We do, however, repair the vast majority of imperfections successfully; any imperfections that remain are intentionally left to preserve the state of such historical works.
„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.
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PAP. Zustand: New. New Book. Shipped from UK. Established seller since 2000. Bestandsnummer des Verkäufers LW-9780260648341
Anzahl: 15 verfügbar
Anbieter: Forgotten Books, London, Vereinigtes Königreich
Paperback. Zustand: New. Print on Demand. This book summarizes progress made in the Joint Program on Methods of Measurement for Semiconductor Materials, Process Control, and Devices. Topics covered include techniques such as infrared methods, thermal property measurements, and wire bonding evaluation. The author covers the research and development of techniques for use throughout the electronics industry for measuring resistivity of bulk, epitaxial, and diffused silicon wafers. This book also delves into methods for studying wire bond systems in semiconductor devices, such as destructive pull testing and the impact of bonding tool motion on wire flexure. The research presented in this book is significant because it provides valuable insights into the development and refinement of measurement methods for semiconductor materials, process control, and devices, ultimately contributing to advancements in the electronics industry. This book is a reproduction of an important historical work, digitally reconstructed using state-of-the-art technology to preserve the original format. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in the book. print-on-demand item. Bestandsnummer des Verkäufers 9780260648341_0
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