Methods of Measurement for Semiconductor Materials, Process Control, and Devices: Quarterly Report; April 1 to June 30, 1969 (Classic Reprint) - Hardcover

Bullis, W. Murray

Hardcover

ISBN 10: 0331408732 ISBN 13: 9780331408737

Verlag: Forgotten Books, 2017

Inhaltsangabe

Excerpt from Methods of Measurement for Semiconductor Materials, Process Control, and Devices<br/><br/>I. An improved method for grasping the wire during a pull test was developed last quarter. Since the wire is grasped with out deformation and the bond may be pulled in any direction, this convenient method, which involves the use of a quick setting hot-melt glue, permits increased control of the test conditions. It is also possible to test single bonds.

Details zur Ausgabe

• Verlag: Forgotten Books
• Erscheinungsdatum: 2017
• Sprache: Englisch
• ISBN 10: 0331408732
• ISBN 13: 9780331408737
• Einband: Gebundene Ausgabe
• Anzahl der Seiten: 56
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