Guidebook for Managing Silicon Chip Reliability (Electronic Packaging) - Softcover

Pecht, Michael; Radojcic, Riko; Rao, Gopal

Softcover

ISBN 10: 0367400065 ISBN 13: 9780367400064

Verlag: CRC Press, 2019

Inhaltsangabe

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.

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Über die Autorin bzw. den Autor

Pecht, Michael; Radojcic, Riko; Rao, Gopal

Details zur Ausgabe

• Verlag: CRC Press
• Erscheinungsdatum: 2019
• Sprache: Englisch
• ISBN 10: 0367400065
• ISBN 13: 9780367400064
• Einband: Taschenbuch
• Anzahl der Seiten: 224
• Kontakt zum Hersteller: Nicht verfügbar
• Verantwortliche Person: Nicht verfügbar