Ambient Intelligence with Microsystems: Augmented Materials and Smart Objects (Microsystems, 18, Band 18) - Hardcover

Hardcover

ISBN 10: 0387462635 ISBN 13: 9780387462639

Verlag: Springer, 2008

Inhaltsangabe

Augmented Materials and Smart Objects investigates the issues required to ensure technology platforms capable of being seamlessly integrated into everyday objects, particularly the requirements for integrated computation and MEMs sensors, System-in-a-package solutions, multi-chip modules, the impact of the trend towards embedded microelectronic electronics sub-systems, novel assembly techniques for autonomous MEMs sensors, as well as practical performance issues that are key to the AmI concept.

Also discussed are current requirements for realizing applications-oriented examples of smart objects (e.g. smart textiles, gadgets, integration of smart systems for utility and environmental monitoring, etc); these are based upon heterogeneous systems linking networks of sensors attached to (or physically embedded in) objects with information management systems enabling collections of smart objects to collaborate to provide proactive services to the user.

Finally, Augmented Materials and Smart Objects describes and discusses a number of vision statements strongly relevant to the future development of distributed embedded sensor and actuator platforms for smart objects, and ultimately Ambient Intelligence. The framework for this is the concept of Augmented Materials; these are materials with fully embedded distributed information systems, designed to measure all relevant physical properties and provide a full knowledge representation of the material; in effect, the material would "know" itself, and its current status.

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Ambient Intelligence with Microsystems: Augmented Materials and Smart Objects

This text investigates relationships that Ambient Intelligence has with current and emerging Microsystems

Ambient Intelligence conceptualizes systems that are proactive, context-aware and unobtrusive. Microsystems enable these systems to be seamlessly integrated into everyday objects.

This work examines the opportunities and challenges in using integrated computing with MEMs sensors. It evaluates the impact of trends towards embedded sub-systems, including System-in-a-Package solutions, as well as rapidly growing areas of research, such as wireless sensor networks.

Methods for realizing smart objects are discussed, including smart textiles, intelligent surfaces, smart tracking and environmental monitoring systems, This provides for an infrastructure of heterogeneous systems attached to (or physically embedded in) everyday objects that enable collections of smart objects to collaborate and provide services.

Technical barriers are discussed as well as methods to meet the challenges of what is a strongly collaborative process. Co-design is integral to this; for optimal results the goal must be co-innovation, with the needs of key stakeholders recognised and addressed.

Ambient Intelligence with Microsystems: Augmented Materials and Smart Objects discusses the vision statements relevant to future embedded sensor platforms for smart objects and, ultimately, Ambient Intelligence.

Readers will find up to-date research in Ambient Intelligence and in Microsystems including;

• A practical approach to realizing concepts within Ambient Intelligence, including new heterogeneous systems infrastructures and international R&D programs
• Analyses of embedded microelectronic sub-systems and novel assembly techniques for autonomous MEMs sensors.
• Reviews of initiatives in collaborative research that are leading to innovation in hardware, networking and software, including the effect of whole-systems methodologies

Ambient Intelligence with Microsystems: Augmented Materials and Smart Objects is written for researchers and professionals in the areas of microsystems, smart materials, ambient and pervasive systems, and those investigating and exploiting wireless sensor networks.

Details zur Ausgabe

• Verlag: Springer
• Erscheinungsdatum: 2008
• Sprache: Englisch
• ISBN 10: 0387462635
• ISBN 13: 9780387462639
• Einband: Gebundene Ausgabe
• Anzahl der Seiten: 436
• Herausgeber: Delaney Kieran
• Kontakt zum Hersteller: Springer Heidelberg; buchhandel-buch@springer.com; ; Tiergartenstr. 17; Heidelberg; 69121; Deutschland