This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables.
Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development.
Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail.
Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.
`A most comprehensive book set, both well presented and well illustrated.'
IEEE Electrical Insulation Magazine, September/October 1997
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables.
Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development.
Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail.
Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.
EUR 6,91 für den Versand von Vereinigtes Königreich nach Deutschland
Versandziele, Kosten & DauerEUR 38,57 für den Versand von USA nach Deutschland
Versandziele, Kosten & DauerAnbieter: Anybook.com, Lincoln, Vereinigtes Königreich
Zustand: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings With owner's name inside cover. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1100grams, ISBN:9780412084515. Bestandsnummer des Verkäufers 9755917
Anzahl: 1 verfügbar
Anbieter: Anybook.com, Lincoln, Vereinigtes Königreich
Zustand: Good. Volume 3. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1150grams, ISBN:9780412084515. Bestandsnummer des Verkäufers 5582662
Anzahl: 1 verfügbar
Anbieter: BennettBooksLtd, North Las Vegas, NV, USA
hardcover. Zustand: New. In shrink wrap. Looks like an interesting title! Bestandsnummer des Verkäufers Q-0412084511
Anzahl: 1 verfügbar
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
Zustand: New. In. Bestandsnummer des Verkäufers ria9780412084515_new
Anzahl: Mehr als 20 verfügbar
Anbieter: moluna, Greven, Deutschland
Gebunden. Zustand: New. This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books. Bestandsnummer des Verkäufers 458434009
Anzahl: Mehr als 20 verfügbar
Anbieter: HPB-Red, Dallas, TX, USA
hardcover. Zustand: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority! Bestandsnummer des Verkäufers S_362962899
Anzahl: 1 verfügbar
Anbieter: Lucky's Textbooks, Dallas, TX, USA
Zustand: New. Bestandsnummer des Verkäufers ABLIING23Feb2215580180160
Anzahl: Mehr als 20 verfügbar
Anbieter: Books Puddle, New York, NY, USA
Zustand: New. pp. 664 2nd Edition. Bestandsnummer des Verkäufers 26534025
Anzahl: 4 verfügbar
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch. Zustand: Neu. Neuware - This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables.Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development.Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail.Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging. Bestandsnummer des Verkäufers 9780412084515
Anzahl: 2 verfügbar
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
Zustand: New. Print on Demand pp. 664 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam. Bestandsnummer des Verkäufers 8362454
Anzahl: 4 verfügbar