A guide for engineers to the latest technology and techniques of solder-to-circuit connections, with special attention given to the behavior of solder in the wetting process. The authors show how to predict solder behavior more accurately, as well as how to utilize soldering methods that achieve high standards of precision, strength, and reliability. All operative mechanisms and processes that occur when a solder joint is formed are discussed. Annotation copyright Book News, Inc. Portland, Or.
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Anbieter: Mispah books, Redhill, SURRE, Vereinigtes Königreich
Hardcover. Zustand: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book. Bestandsnummer des Verkäufers ERICA77504420175296
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