Inhaltsangabe
This edition continues to focus on educating the electronics engineer in surface mount principles, mainstream industry practices and technology options. The chapters are a "walk-through" of the actual assembly process. An additional chapter discusses the effect of high pin count devices (fine pitch, BGA and PGA) and their impact on the board assembly. Included is an appendix of vendors for components, sockets, material processes and equipment. Expanded coverage of water soluble paste, no clean paste and lead free solder addressses the environmental issues new to this industry.
Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.
