Rapid Thermal Processing for Future Semiconductor Devices - Softcover

 
9780444513397: Rapid Thermal Processing for Future Semiconductor Devices
Softcover
ISBN 10: 0444513396 ISBN 13: 9780444513397
Verlag: Elsevier Science, 2003

Inhaltsangabe

This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V compound semiconductor devices. This book covers the following areas: advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe, hetero-structure, novel metallization, inter-connect, silicidation, low-k materials, thin dielectrics including gate dielectrics and high-k materials, thin film deposition including SiGe, SOI and SiC, process and device modelling, Laser-assisted crystallization and TFT device fabrication technologies, temperature monitoring and slip-free technologies.

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Verlag
Elsevier Science
Erscheinungsdatum
2003
Sprache
Englisch
ISBN 10 
0444513396
ISBN 13 
9780444513397
Einband
Taschenbuch
Anzahl der Seiten
160
Herausgeber
Fukuda Hisashi
Kontakt zum Hersteller
Nicht verfügbar
Verantwortliche Person
gpsr@libri.de
gpsr@libri.de

Friedensallee 273
Hamburg
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Deutschland