Wafer Manufacturing: Shaping of Single Crystal Silicon Wafers - Hardcover

Kao, Imin; Chung, Chunhui

Hardcover

ISBN 10: 0470061219 ISBN 13: 9780470061213

Verlag: Wiley, 2021

Inhaltsangabe

Presenting all the major stages in wafer manufacturing, from crystals to prime wafers.

This book first outlines the physics, associated metrology, process modelling and quality requirements and the goes on to discuss wafer forming and wafer surface preparation techniques.  The whole is rounded off with a chapter on the research and future challenges in wafer manufacturing.

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Über die Autorin bzw. den Autor

Imin Kao, is Professor in the Department of Mechanical Engineering at the State University of New York in Stony Brook, USA. He is Faculty Director of the Undergraduate College in Information and Technology Studies. He holds three patents, and his research foci include robotic manipulation with soft contacts and smart contact surface technology using MEMS.

Chunhui Chung, is Associate Professor in the Department of Mechanical Engineering at the National Cheng Kung University in Taiwan.

Von der hinteren Coverseite

Get an academic and industrial perspective on wafer manufacturing with this comprehensive and up-to-date resource

Wafer Manufacturing: Shaping of Single Crystal Silicon Wafers delivers a comprehensive exploration of all the major stages in wafer manufacturing, from crystals to prime wafers. The distinguished authors have created a resource ideal for both researchers and developers that covers modern research and engineering practice in detail.

The book offers information on the state-of-the-art in wafer manufacturing, including new uses of wafers like Silicon-on-Insulator, Strained Silicon, MEMS, and MOEMS. It also discusses techniques that are equally applicable to other semiconductors such as III-V, II-VI, and IV-IV compounds.

The information contained within Wafer Manufacturing is geared towards relevant industry practices and allows for a refined understanding of process control and the manufacturing process. This allows the reader to implement the technology described in the book on a large scale.

Future challenges facing the wafer manufacturing industry, as well as potentially fruitful avenues of research are discussed as well. Readers will also benefit from:

• A thorough introduction to wafers and semiconductors, including discussions of the semiconductor revolution and silicon wavers used in device manufacturing
• An exploration of the generalized processes and flow of wafer manufacturing, including crystal growth and wafer forming
• An analysis of the physical and mechanical properties of a biobased composite with sisal powder
• A treatment of process modeling and manufacturing processes, including discussions of brittle materials, ductile machining, and abrasive machining
• An analysis of wafer slicing using a modern slurry wiresaw as well as other types of saws

Perfect for materials scientists and engineers, semiconductor physicists and technologists, and electrical engineers, Wafer Manufacturing: Shaping of Single Crystal Silicon Wafers will also earn a place in the libraries of professionals working in the semiconductor industry and information technology engineers who wish to better their understanding of the latest developments in wafer manufacturing.

Aus dem Klappentext

Get an academic and industrial perspective on wafer manufacturing with this comprehensive and up-to-date resource

Wafer Manufacturing: Shaping of Single Crystal Silicon Wafers delivers a comprehensive exploration of all the major stages in wafer manufacturing, from crystals to prime wafers. The distinguished authors have created a resource ideal for both researchers and developers that covers modern research and engineering practice in detail.

The book offers information on the state-of-the-art in wafer manufacturing, including new uses of wafers like Silicon-on-Insulator, Strained Silicon, MEMS, and MOEMS. It also discusses techniques that are equally applicable to other semiconductors such as III-V, II-VI, and IV-IV compounds.

The information contained within Wafer Manufacturing is geared towards relevant industry practices and allows for a refined understanding of process control and the manufacturing process. This allows the reader to implement the technology described in the book on a large scale.

Future challenges facing the wafer manufacturing industry, as well as potentially fruitful avenues of research are discussed as well. Readers will also benefit from:

• A thorough introduction to wafers and semiconductors, including discussions of the semiconductor revolution and silicon wavers used in device manufacturing
• An exploration of the generalized processes and flow of wafer manufacturing, including crystal growth and wafer forming
• An analysis of the physical and mechanical properties of a biobased composite with sisal powder
• A treatment of process modeling and manufacturing processes, including discussions of brittle materials, ductile machining, and abrasive machining
• An analysis of wafer slicing using a modern slurry wiresaw as well as other types of saws

Perfect for materials scientists and engineers, semiconductor physicists and technologists, and electrical engineers, Wafer Manufacturing: Shaping of Single Crystal Silicon Wafers will also earn a place in the libraries of professionals working in the semiconductor industry and information technology engineers who wish to better their understanding of the latest developments in wafer manufacturing.

Details zur Ausgabe

• Verlag: Wiley
• Erscheinungsdatum: 2021
• Sprache: Englisch
• ISBN 10: 0470061219
• ISBN 13: 9780470061213
• Einband: Gebundene Ausgabe
• Auflage: 1
• Anzahl der Seiten: 304
• Kontakt zum Hersteller: Wiley-VCH GmbH; product_safety@wiley.com; ; Boschstrasse 12; Weinheim; 69469; Deutschland