Modern Electroplating (Electrochemical Society Series) - Hardcover

 
9780471168249: Modern Electroplating (Electrochemical Society Series)
Hardcover
ISBN 10: 0471168246 ISBN 13: 9780471168249
Verlag: John Wiley & Sons, 2000

Inhaltsangabe

A new collection of authoritative contributions on the state of the art of electrochemical deposition
Since the last edition of Modern Electroplating was published over a quarter century ago, electrochemical deposition has evolved into a mature science, with many new and potential applications. To address these developments, Modern Electroplating, Fourth Edition presents an entirely new collection of contributions on a wide range of cutting-edge topics, from electrodeposition of semiconductors to environmental considerations.
Geared to experienced deposition practitioners and novices alike, the new edition provides clear, thorough, up-to-date explanations of the principles and applications of highly relevant deposition techniques. It not only replaces the Third Edition, a very useful resource on electroplating processes, but, in addition, highlights the transition in the electronics industry from physical to electrochemical methods, especially with regard to next-generation technologies such as copper interconnect. Coverage includes:
* Electrodeposition of various metals and metal alloys
* Electrodeposition of semiconductors and electrodeposition on nonconductors
* Electrodeposition of conductive polymers
* Electroless deposition of various metals and alloys
* Preparation procedures for deposition
* Manufacturing technologies, monitoring, testing, and control
* Deposition and the environment

Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.

Über die Autorin bzw. den Autor

MORDECHAY SCHLESINGER, PhD, is a professor in the Department of Physics at the University of Windsor, Ontario, Canada.
 
MILAN PAUNOVIC, PhD, is a researcher at IBM, T. J. Watson Research Center, Yorktown Heights, New York.

Von der hinteren Coverseite

A new collection of authoritative contributions on the state of the art of electrochemical deposition
 
Since the last edition of Modern Electroplating was published over a quarter century ago, electrochemical deposition has evolved into a mature science, with many new and potential applications. To address these developments, Modern Electroplating, Fourth Edition presents an entirely new collection of contributions on a wide range of cutting-edge topics, from electrodeposition of semiconductors to environmental considerations.
 
Geared to experienced deposition practitioners and novices alike, the new edition provides clear, thorough, up-to-date explanations of the principles and applications of highly relevant deposition techniques. It not only replaces the Third Edition, a very useful resource on electroplating processes, but, in addition, highlights the transition in the electronics industry from physical to electrochemical methods, especially with regard to next-generation technologies such as copper interconnect. Coverage includes:
* Electrodeposition of various metals and metal alloys
* Electrodeposition of semiconductors and electrodeposition on nonconductors
* Electrodeposition of conductive polymers
* Electroless deposition of various metals and alloys
* Preparation procedures for deposition
* Manufacturing technologies, monitoring, testing, and control
* Deposition and the environment

„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.

Verlag
John Wiley & Sons
Erscheinungsdatum
2000
Sprache
Englisch
ISBN 10 
0471168246
ISBN 13 
9780471168249
Einband
Gebundene Ausgabe
Auflage
4
Anzahl der Seiten
888
Herausgeber
Schlesinger Mordechay, Paunovic Milan
Kontakt zum Hersteller
Nicht verfügbar
Verantwortliche Person
Nicht verfügbar