In recent years, customer demands for higher speeds and smaller chips have resulted in the use of interconnections in multilevel and multilayer configurations. Various issues associated with very large scale integrated circuit (VLSIC) interconnections used for high-speed applications are emphasized. Written for those who want to gain a better understanding of the factors associated with modeling, analyzing and simulating high-density, high-speed interconnections, the chapters are designed so that they can be read independently.
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Anbieter: Goodwill of Silicon Valley, SAN JOSE, CA, USA
Zustand: good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Good condition! Any other included accessories are also in Good condition showing use. Use can include some highlighting and writing, page and cover creases as well as other types visible wear. Bestandsnummer des Verkäufers GWSVV.0471571229.G
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Anbieter: Anybook.com, Lincoln, Vereinigtes Königreich
Zustand: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. Dust jacket in good condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1150grams, ISBN:9780471571223. Bestandsnummer des Verkäufers 5834234
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Anbieter: Dorley House Books, Inc., Hagerstown, MD, USA
Hardcover. Zustand: Very Good. Zustand des Schutzumschlags: Near Fine. Diagrams; Formulae (illustrator). 1st. dj in mylar; 622 clean, unmarked pages; 1st printing. Bestandsnummer des Verkäufers 036221
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