Integrated Circuit Failure Analysis: A Guide to Preparation Techniques (Quality and Reliability Engineering Series) - Hardcover

Beck

 
9780471974017: Integrated Circuit Failure Analysis: A Guide to Preparation Techniques (Quality and Reliability Engineering Series)
Hardcover
ISBN 10: 0471974013 ISBN 13: 9780471974017
Verlag: John Wiley & Sons, 1998

Inhaltsangabe

Fault analysis of highly-integrated semiconductor circuits has become an indispensable discipline in the optimization of product quality. Integrated Circuit Failure Analysis describes state-of-the-art procedures for exposing suspected failure sites in semiconductor devices. The author adopts a hands-on problem-oriented approach, founded on many years of practical experience, complemented by the explanation of basic theoretical principles. Features include: Advanced methods in device preparation and technical procedures for package inspection and semiconductor reliability. Illustration of chip isolation and step-by-step delayering of chips by wet chemical and modern plasma dry etching techniques. Particular analysis of bipolar and MOS circuits, although techniques are equally relevant to other semiconductors. Advice on the choice of suitable laboratory equipment. Numerous photographs and drawings providing guidance for checking results. Focusing on modern techniques, this practical text will enable both academic and industrial researchers and IC designers to expand the range of analytical and preparative methods at their disposal and to adapt to the needs of new technologies.

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Über die Autorin bzw. den Autor

Friedrich Beck is the author of Integrated Circuit Failure Analysis: A Guide to Preparation Techniques, published by Wiley.

Von der hinteren Coverseite

Fault analysis of highly-integrated semiconductor circuits has become an indispensable discipline in the optimization of product quality. Integrated Circuit Failure Analysis describes state-of-the-art procedures for exposing suspected failure sites in semiconductor devices. The author adopts a hands-on problem-oriented approach, founded on many years of practical experience, complemented by the explanation of basic theoretical principles. Features include: Advanced methods in device preparation and technical procedures for package inspection and semiconductor reliability. ? Illustration of chip isolation and step-by-step delayering of chips by wet chemical and modern plasma dry etching techniques. ? Particular analysis of bipolar and MOS circuits, although techniques are equally relevant to other semiconductors. ? Advice on the choice of suitable laboratory equipment. ? Numerous photographs and drawings providing guidance for checking results. Focusing on modern techniques, this practical text will enable both academic and industrial researchers and IC designers to expand the range of analytical and preparative methods at their disposal and to adapt to the needs of new technologies.

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Verlag
John Wiley & Sons
Erscheinungsdatum
1998
Sprache
Englisch
ISBN 10 
0471974013
ISBN 13 
9780471974017
Einband
Tapa dura
Auflage
1
Anzahl der Seiten
192
Kontakt zum Hersteller
Nicht verfügbar
Verantwortliche Person
Nicht verfügbar