Characterization of Integrated Circuit Packaging Materials (Materials Characterization) - Hardcover

Moore, Thomas M.

Hardcover

ISBN 10: 0750692677 ISBN 13: 9780750692670

Verlag: Butterworth-Heinemann Ltd, 1993

Inhaltsangabe

Characterization of Integrated Circuit Packaging Materials deals with the systems of materials that comprise IC packages. Chapters in this volume address important characteristics of IC packages. It demonstrates analytical techniques appropriate for IC package characterization through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. This book discusses issues which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board, and multi-chip models.

Details zur Ausgabe

• Verlag: Butterworth-Heinemann Ltd
• Erscheinungsdatum: 1993
• Sprache: Englisch
• ISBN 10: 0750692677
• ISBN 13: 9780750692670
• Einband: Gebundene Ausgabe
• Anzahl der Seiten: 292
• Herausgeber: McKenna Robert G.
• Kontakt zum Hersteller: Nicht verfügbar
• Verantwortliche Person: Nicht verfügbar