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Characterization of Integrated Circuit Packaging Materials (Materials Characterization) - Hardcover

Moore, Thomas M.

 
9780750692670: Characterization of Integrated Circuit Packaging Materials (Materials Characterization)
Hardcover
ISBN 10: 0750692677 ISBN 13: 9780750692670
Verlag: Butterworth-Heinemann Ltd, 1993

Inhaltsangabe

Characterization of Integrated Circuit Packaging Materials deals with the systems of materials that comprise IC packages. Chapters in this volume address important characteristics of IC packages. It demonstrates analytical techniques appropriate for IC package characterization through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. This book discusses issues which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board, and multi-chip models.

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Verlag
Butterworth-Heinemann Ltd
Erscheinungsdatum
1993
Sprache
Englisch
ISBN 10 
0750692677
ISBN 13 
9780750692670
Einband
Gebundene Ausgabe
Anzahl der Seiten
292
Herausgeber
McKenna Robert G.
Kontakt zum Hersteller
Nicht verfügbar
Verantwortliche Person
Nicht verfügbar