Verwandte Artikel zu Advances in Thermal Modeling of Electronic Components...

Advances in Thermal Modeling of Electronic Components and Systems - Hardcover

 
9780791800157: Advances in Thermal Modeling of Electronic Components and Systems
Hardcover
ISBN 10: 0791800156 ISBN 13: 9780791800157
Verlag: American Society of Mechanical Engineers,U.S., 1990

Inhaltsangabe

The explosive growth in chip power dissipation, resulting from greater transistor density and electronic functionality, has spawned numerous studies of thermal control techniques for single chip packages and multichip modules. This book presents current information on: Air and liquid cooling; Extended surface arrays; and Heat sinks. In addition, it offers a critical review of recent technical and patent literature in electronics cooling. This text is of special value to program managers, technologist and packaging engineers in the electronics industry; and researchers in University and government laboratories.

Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.

Verlag
American Society of Mechanical Engineers,U.S.
Erscheinungsdatum
1990
Sprache
Englisch
ISBN 10 
0791800156
ISBN 13 
9780791800157
Einband
Gebundene Ausgabe
Herausgeber
Bar-Cohen Avram, Kraus Allan D.
Kontakt zum Hersteller
Nicht verfügbar
Verantwortliche Person
Nicht verfügbar