Microscale Heat Conduction in Integrated Circuits and Their Constituent Films (Microsystems, 6, Band 6) - Hardcover

Sungtaek Ju, Y.; Goodson, Kenneth E.

Hardcover

ISBN 10: 0792385918 ISBN 13: 9780792385912

Verlag: Springer, 1999

Inhaltsangabe

1 Introduction.- 1.1 Thermal Issues in Integrated Circuit Elements.- 1.2 Scope of Research.- 1.3 Book Overview.- 2 Review of Microscale Thermometry Techniques.- 2.1 Electrical Methods.- 2.2 Optical Methods.- 3 High Spatial and Temporal Resolution Thermometry.- 3.1 Thermoreflectance Thermometry Technique.- 3.2 Thermal Characterization of Silicon-on-Insulator High-Voltage Transistors.- 3.3 Thermal Characterization of Interconnects.- 4 Thermal Properties of Amorphous Dielectric Films.- 4.1 Thermal Characterization Techniques for Dielectric Films.- 4.2 Heat Transport in Amorphous Silicon Dioxide.- 5 Heat Conduction in Crystalline Silicon Films.- 5.1 Phonon Dispersion and its Implication on the Estimation of the Phonon Mean Free Path.- 5.2 Measurements of In-Plane Thermal Conductivities of Silicon Films.- 5.3 Heat Conduction in Semiconductors at High Temperatures.- 5.4 Prediction of the In-Plane Thermal Conductivity of Silicon Thin Films.- 5.5 Simplified Phonon Transport Equations Accounting for Phonon Dispersion.- 5.6 Hot Phonon Effects.- 6 Summary and Recommendations.- 6.1 Atomistic Simulations of Heat Transport.- 6.2 Thermal Conductivities of Nanostructures.- 6.3 Detailed Simulations of Semiconductor Device.- A Uncertainty Analysis.- A.1 Uncertainly in the Temperature Rise.- A.2 Uncertainly in the Thermal Properties of Dielectric Films.- A.3 Uncertainly in the In-Plane Thermal Conductivity of Thin Films.

Details zur Ausgabe

• Verlag: Springer
• Erscheinungsdatum: 1999
• Sprache: Englisch
• ISBN 10: 0792385918
• ISBN 13: 9780792385912
• Einband: Gebundene Ausgabe
• Anzahl der Seiten: 123
• Kontakt zum Hersteller: ProductSafety@springernature.com; ProductSafety@springernature.com; ; Poststr. 9; Darmstadt; 64293; Deutschland