Advanced Routing of Electronic Modules: 2 (Electronic Packaging) - Hardcover

Pecht, Michael; Wong, Yeun Tsun

Hardcover

ISBN 10: 0849396220 ISBN 13: 9780849396229

Verlag: CRC Press, 1995

Inhaltsangabe

The rapid growth of the electronic products market has created an increasing need for affordable, reliable, high-speed and high-density multi-layer printed circuit boards (PCBs). This book presents the technologies, algorithms, and methodologies for engineers and others developing the next generation of electronic products. A vision of the future in advanced electronics Advanced Routing of Electronic Modules provides both fundamental theory and advanced technologies for improving routing. Beginning chapters discuss approaches to approximate a minimum rectilinear Steiner tree from a minimum spanning tree and introduce ways to avoid obstacles for routing simple multi-terminal nets sequentially in a workspace. Timing delay, clock skew, and noise control requirements in signal integrity are described as well as computer-aided approaches to managing these requirements in high-speed PCB/MCM routing. Later chapters present the two-layer wiring problem, rip-up and reroute approaches, and parallel routing, including global routing, boundary crossing placement, and detailed maze routing in hardware acceleration. Data structures, data management, and algorithms for parallel routing in a multiple-processor hardware systems are also covered.

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Michael Pecht, Yeun Tsun Wong

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This book presents the technologies, algorithms, and methodologies for engineers and others developing the next generation of products.

Details zur Ausgabe

• Verlag: CRC Press
• Erscheinungsdatum: 1995
• Sprache: Englisch
• ISBN 10: 0849396220
• ISBN 13: 9780849396229
• Einband: Tapa dura
• Auflage: 1
• Anzahl der Seiten: 470
• Kontakt zum Hersteller: Nicht verfügbar
• Verantwortliche Person: Nicht verfügbar