MEMS Packaging (Materials, Circuits and Devices) - Hardcover

Hsu, Tai-Ran

 
9780863413353: MEMS Packaging (Materials, Circuits and Devices)
Hardcover
ISBN 10: 0863413358 ISBN 13: 9780863413353
Verlag: Institution of Engineering and Technology, 2003

Inhaltsangabe

MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and mircrosystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing.

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Über die Autorin bzw. den Autor

Professor Tai-Ran Hsu received his PhD in mechanical engineering from McGill University, Canada. He worked extensively in the power plant equipment and nuclear industries before moving into academia. He is currently Professor and Director of Microsystems Design and Packaging Laboratory at San Jose State University, and has published over 120 technical papers and five books in FE, CAD and MEMS design, manufacture and packaging.

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Verlag
Institution of Engineering and Technology
Erscheinungsdatum
2003
Sprache
Englisch
ISBN 10 
0863413358
ISBN 13 
9780863413353
Einband
Gebundene Ausgabe
Anzahl der Seiten
304
Kontakt zum Hersteller
Nicht verfügbar
Verantwortliche Person
Nicht verfügbar