LCP for Microwave Packages and Modules (Cambridge RF and Microwave Engineering) - Hardcover

Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara

Hardcover

ISBN 10: 1107003784 ISBN 13: 9781107003781

Verlag: Cambridge University Press, 2012

Inhaltsangabe

A comprehensive overview of RF microelectronic design using Liquid Crystal Polymer (LCP) at package, component and system levels.

Über diesen Titel

Über die Autorinnen und Autoren

Anh-Vu H. Pham is a Professor at the University of California, Davis, where he leads the Microwave Microsystems Lab. He has published around 100 peer-reviewed papers, several book chapters and one book, is currently the Vice Chair of IEEE International Microwave Symposium Technical Committee on Power Amplifiers and Integrated Devices and a Microwave Distinguished Lecturer of the IEEE MTT for the term 2010-2012.

Morgan J. Chen is a Staff Engineer at FutureWei Technologies, an R&D US subsidiary of Huawei Technologies. He has worked in both academia and industry for over a decade, advancing high-frequency packaging from DC to past 60 GHz.

Kunia Aihara is an Electronics Engineer in the RF/EO Subsystems branch of the Air Force Research Laboratory.

Details zur Ausgabe

• Verlag: Cambridge University Press
• Erscheinungsdatum: 2012
• Sprache: Englisch
• ISBN 10: 1107003784
• ISBN 13: 9781107003781
• Einband: Gebundene Ausgabe
• Anzahl der Seiten: 250
• Kontakt zum Hersteller: Nicht verfügbar
• Verantwortliche Person: Avery; https://www.avery.fr/; ; chemin des peupliers 27; Dardilly; Frankreich