Interconnect Technology and Design for Gigascale Integration - Hardcover

 
9781402076060: Interconnect Technology and Design for Gigascale Integration
Hardcover
ISBN 10: 1402076061 ISBN 13: 9781402076060
Verlag: Springer, 2003

Inhaltsangabe

Interconnect Technology and Design for Gigascale Integration is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T.J. Watson Research Center, LSI Logic, and SUN microsystems. The material found in this book is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in depth exploration into interconnect-aware computer architectures. This broad swath of topics presented by leaders in the research field is intended to provide a comprehensive perspective on interconnect technology and design issues so that the reader will understand the implications of the semiconductor industry's next substantial milestone - gigascale integration.

Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.

Verlag
Springer
Erscheinungsdatum
2003
Sprache
Englisch
ISBN 10 
1402076061
ISBN 13 
9781402076060
Einband
Gebundene Ausgabe
Anzahl der Seiten
424
Herausgeber
Davis Jeffrey A., Meindl James D.
Kontakt zum Hersteller
Springer Nature Customer Service Center GmbH
ProductSafety@springernature.com

Tiergartenstr. 17
Heidelberg
69121
Deutschland

Weitere beliebte Ausgaben desselben Titels

9781461350880: Interconnect Technology and Design for Gigascale Integration

Vorgestellte Ausgabe

ISBN 10:  1461350883 ISBN 13:  9781461350880
Verlag: Springer, 2003
Softcover