Verwandte Artikel zu Advanced Wirebond Interconnection Technology
Inhaltsangabe
From the reviews:
"This book is intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers. Operational issues such as specifying and optimizing wire and automatic bonders for a product line are included.
The book is very good with "visual" explanations for quick grasping of the issues. In addition, the fundamental metallurgical or mechanical root causes behind material and process choices are presented.
The book has a clear prose style and a very readable font and page layout. The figures, although effective, are simply low resolution screen prints from a personal computer and thus have aliasing and fuzziness.
This book has excellent overall tutorial and enough description of wire and bonding equipment so the reader could specify and negotiate correctly for with suppliers. The majority of the book dwells on establishing the bonding process for a particular product; determining the "window" of adjustments. The book ends with discussions on establishing quality metrics and reliability assurance tests.
Each chapter of the book includes enough tutorial information to allow it to alone with little need to page backwards. A short but good reference section is at the end.
If you have not read a wirebonding book, or the one you read 10 years ago was borrowed and never returned, now is the time to buy this book." ( CMPT Newsletter, June 2005)
Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.
Críticas
From the reviews:
"....intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers.... This book has excellent overall tutorial and enough description of wire and bonding equipment.... If you have not read a wirebonding book, or the one you read 10 years ago was borrowed and never returned, now is the time to buy this book." (IEEE CPMT, Newsletter)
"This book is intended for an assembly ... . is very good with ‘visual’ explanations for quick grasping of the issues. ... The book has a clear prose style and a very readable font and page layout. ... has excellent overall tutorial and enough description of wire and bonding equipment so the reader could specify and negotiate correctly for with suppliers. ... A short but good reference section is at the end." (David W. Palmer, IEEE / CPUT Newsletter, Vol. 28 (2), 2005)
Reseña del editor
From the reviews:
"This book is intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers. Operational issues such as specifying and optimizing wire and automatic bonders for a product line are included.
The book is very good with "visual" explanations for quick grasping of the issues. In addition, the fundamental metallurgical or mechanical root causes behind material and process choices are presented.
The book has a clear prose style and a very readable font and page layout. The figures, although effective, are simply low resolution screen prints from a personal computer and thus have aliasing and fuzziness.
This book has excellent overall tutorial and enough description of wire and bonding equipment so the reader could specify and negotiate correctly for with suppliers. The majority of the book dwells on establishing the bonding process for a particular product; determining the "window" of adjustments. The book ends with discussions on establishing quality metrics and reliability assurance tests.
Each chapter of the book includes enough tutorial information to allow it to alone with little need to page backwards. A short but good reference section is at the end.
If you have not read a wirebonding book, or the one you read 10 years ago was borrowed and never returned, now is the time to buy this book." ( CMPT Newsletter, June 2005)
„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.
- VerlagSpringer
- Erscheinungsdatum2004
- ISBN 10 1402077629
- ISBN 13 9781402077623
- EinbandTapa dura
- SpracheEnglisch
- Anzahl der Seiten704
- Kontakt zum HerstellerNicht verfügbar
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Advanced Wirebond Interconnection Technology
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Zustand: New. From the reviews: This book is intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers. Operational issues such as specifying and optimizing wire and autom. Bestandsnummer des Verkäufers 4095296
Anzahl: Mehr als 20 verfügbar
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Advanced Wirebond Interconnection Technology
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Advanced Wirebond Interconnection Technology
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Zustand: New. Bestandsnummer des Verkäufers 2409167-n
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Advanced Wirebond Interconnection Technology
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Zustand: As New. Unread book in perfect condition. Bestandsnummer des Verkäufers 2409167
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Advanced Wirebond Interconnection Technology
Anbieter: Mispah books, Redhill, SURRE, Vereinigtes Königreich
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Hardcover. Zustand: Like New. Like New. book. Bestandsnummer des Verkäufers ERICA77314020776296
Anzahl: 1 verfügbar
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Advanced Wirebond Interconnection Technology
Anbieter: GreatBookPrices, Columbia, MD, USA
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Zustand: As New. Unread book in perfect condition. Bestandsnummer des Verkäufers 2409167
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Advanced Wirebond Interconnection Technology
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
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Taschenbuch. Zustand: Neu. Neuware - Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way. Bestandsnummer des Verkäufers 9781402077623
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