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The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs. The book further reports silicon measurements, and new test and noise isolation structures. To the authors’ knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC.
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Über die Autorin bzw. den Autor
Mohammed Ismail is the Springer Series Advisor for the Analog Circuits and Signal Processing book series
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Substrate Noise Coupling in RFICs addresses substrate noise coupling in RF and mixed signal ICs when used in a system on chip (SoC) containing digital ICs as well. This trend of integrating RF, mixed signal ICs with large digital ICs is found in many of today's commercial ICs such as single chip Wi-Fi or Bluetooth solutions and is expected to grow rapidly in the future. The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs . This is particularly critical when process feature sizes scale down to the nano meter range.
Substrate Noise Coupling in RFICs reports silicon measurements, new test and noise isolation structures as well as calibration of a design flow used in the design and debug phases of RFICs. A design guide is articulated to be used by RFIC designers to maximize signal isolation and optimize chip floor plan, power and ground domains. Industrial examples of RFICs are given as demonstration vehicles to validate the proposed techniques. Some emphasis is put on the design of on-chip spiral inductors and the impact of the substrate on their performance. To our knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC.
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Gebunden. Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Addresses substrate noise coupling in RF and mixed signal ICs when used in a system on chip(SoC) containing digital ICs as wellGreat reference for courses in RFIC and mixed signal ICs, and for design project coursesReports silicon measureme. Bestandsnummer des Verkäufers 4095399
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Buch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs. The book further reports silicon measurements, and new test and noise isolation structures. To the authors' knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC. 119 pp. Englisch. Bestandsnummer des Verkäufers 9781402081651
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Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Substrate noise coupling in integrated circuits (ICs) is the process by which int- ference signals in the form of voltage and current glitches cause parasitic currents to ow in the silicon substrate to various parts of the IC. The source of such glitches and parasitic currents could be from the switching noise of high speed digital clocks on the same chip. In RF and mixed signal ICs the switching noise is coupled to sensitive analog and RF nodes in the IC causing degradation in performance that could severely impact the yield. Thus, overcoming substrate coupling is a key issue in successful 'system on chip' rst-pass integration where RF and mixed signal blocks, high speed digital I/O interface are integrated with digital signal proce- ing algorithms on the same chip. This is particularly true as we move to sub-90 nanometer system on chip integration. In this book a substrate aware design ow is built, calibrated to silicon and used as part of the design and validation ows to uncover and x substrate coupling problems in RF ICs. The ow is used to develop a comprehensive RF substrate noise isolation design guide to be used by RF designers during the oor planning, circuit design and validation phases. This will allow designers to optimize the - sign, maximize noise isolation and protect sensitive analog/RF blocks from being degraded by substrate noise coupling. Bestandsnummer des Verkäufers 9781402081651
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Gebundene Ausgabe. Zustand: Sehr gut. Gebraucht - Sehr gut SG - leichte Beschädigungen oder Verschmutzungen, ungelesenes Mängelexemplar, gestempelt - The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs. The book further reports silicon measurements, and new test and noise isolation structures. To the authors' knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC. Bestandsnummer des Verkäufers INF1000547085
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