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Reliability of Microtechnology: Interconnects, Devices and Systems - Hardcover

Liu, Johan; Salmela, Olli; Sarkka, Jussi; Morris, James E.; Tegehall, Per-Erik; Andersson, Cristina

 
9781441957597: Reliability of Microtechnology: Interconnects, Devices and Systems
Hardcover
ISBN 10: 1441957596 ISBN 13: 9781441957597
Verlag: Springer, 2011

Inhaltsangabe

Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.

The book also includes exercises and detailed solutions at the end of each chapter.

Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.

Von der hinteren Coverseite

Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also:

  • Discusses the general failure mechanisms of microsystems on a component level
  • Offers comprehensive coverage of solder joint reliability at the microsystems level
  • Analyzes�quality issues and manufacturing at the microsystems level

Reliability of Microtechnology is an ideal volume for researchers and professional engineers working in reliability and manufacturing. The book also includes exercises and detailed solutions at the end of each chapter.

„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.

Verlag
Springer
Erscheinungsdatum
2011
Sprache
Englisch
ISBN 10 
1441957596
ISBN 13 
9781441957597
Einband
Gebundene Ausgabe
Anzahl der Seiten
217
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