Solder Joint Reliability: Theory and Applications - Softcover

Lau, John H.

Softcover

ISBN 10: 1461539110 ISBN 13: 9781461539117

Verlag: Springer, 2011

Inhaltsangabe

1. Flux Reactions and Solderability.- 1.1 Flux History.- 1.2 Solderability Tests.- 1.2.1 Visual Assessment.- 1.2.2 Area of Spread Test.- 1.2.3 Edge Dip and Capillary Rise Tests.- 1.2.4 Globule Test.- 1.2.5 Rotary Dip Test.- 1.2.6 Surface Tension Balance Test.- 1.3 Flux Action from Solderability Measurements.- 1.4 Flux Types.- 1.4.1 Mechanistic Studies for Inorganic Fluxes.- 1.4.2 Mechanistic Studies for Rosin-based Fluxes.- References.- 2. Solder Paste Technology and Applications.- 2.1 Chemical and Physical Characteristics.- 2.2 Fluxing and Fluxes.- 2.3 Solder Alloys.- 2.4 Solder Powder.- 2.5 Paste Formulation.- 2.6 Paste Rheology.- 2.7 Rheology Behavior Characterization.- 2.8 Viscosity and Measurement.- 2.9 Printing Technique.- 2.10 Dispensing Technique.- 2.11 Soldering Principle.- 2.12 Solderability.- 2.13 Soldering Methods.- 2.14 Controlled Atmosphere Soldering.- 2.15 Solvent Cleaning.- 2.16 Aqueous Cleaning and Aqueous Cleaning Paste.- 2.17 No-clean Paste.- 2.18 Fine Pitch Paste.- 2.19 Quality.- 2.20 Conclusion.- References.- 3. Technical Considerations in Vapor Phase and Infrared Solder Reflow Processes.- 3.1 Introduction to Surface Mount Reflow Soldering.- 3.2 Type I.- 3.3 Soldering Requirements for Surface Mount Technology.- 3.4 Reflow Process Phases.- 3.5 Reflow Equipment.- 3.5.1 Infrared.- 3.5.2 Vapor Phase.- 3.5.3 Convection.- 3.5.4 Conductive Belt.- 3.5.5 Laser Soldering.- 3.6 Prereflow Solder Paste Bake.- 3.7 Maximizing Solder Joint Yield.- 3.8 Reflow Processing.- 3.8.1 Vapor Phase.- 3.8.2 Infrared.- 3.8.3 Cost Comparison.- 3.9 SMT Reliability.- References.- 4. Optimizing the Wave Soldering Process.- 4.1 Basic Wave Soldering Process Overview.- 4.2 Wave Soldering Process Hardware.- 4.2.1 Fluxing.- 4.2.2 Fluxers.- 4.2.3 Fluxer Measurement Parameters.- 4.2.4 Fluxer Optimization.- 4.2.5 Preheating.- 4.2.6 Preheaters.- 4.2.7 Preheat Measurement Parameters.- 4.2.8 Preheat Optimization.- 4.2.9 Wave Soldering.- 4.2.10 Solder Waves.- 4.2.11 Solder Wave Measurement Parameters.- 4.2.12 Wave Soldering Optimization.- 4.2.13 Solidification.- 4.2.14 Conveyors.- 4.3 Wave Soldering Process Parameter Optimization.- 4.3.1 Optimization Procedure Test Study.- 4.4 Results.- 4.5 Conclusion.- References.- 5. Post-Solder Cleaning Considerations.- 5.1 Purpose and Chapter Description.- 5.2 Environmental Concerns.- 5.3 Definition of Soldering Flux.- 5.4 Specifications.- 5.4.1 Test Methods.- 5.4.2 Institute for Interconnecting and Packaging Electronic Circuits (IPC).- 5.4.3 U.S. Military.- 5.4.4 Telecommunications.- 5.5 Flux Materials and Associated Cleaning.- 5.5.1 Rosin.- 5.5.2 Water Soluble.- 5.5.3 Synthetic Activated.- 5.5.4 Low Solids (No-Clean).- 5.5.5 Controlled Atmosphere Soldering.- 5.6 Flux Application Methods.- 5.6.1 Wave.- 5.6.2 Foam.- 5.6.3 Spray.- 5.6.4 Rotating Drum Spray.- 5.6.5 Application Issues for Low Solids Fluxes.- 5.7 Process Issues Associated with Reliability.- 5.7.1 Flux Residue.- 5.7.2 Solder Ball Formation.- 5.7.3 Top-Side Fillet Formation.- 5.7.4 Conformal Coating Compatibility.- 5.8 Non-Liquid Fluxes.- 5.8.1 Core Solder Material.- 5.8.2 Solder Paste Material.- 5.9 Trends.- References.- Additional Readings.- 6. Scanning Electron Microscopy/Energy Dispersive X-Ray (SEM/EDX) Characterization of Solder-Solderability and Reliability.- 6.1 Scanning Electron Microscopy/Energy Dispersive X-ray Analysis.- 6.2 Other Methods-WDX.- 6.3 Detection Modes.- 6.4 Sample Preparation.- 6.5 Different Phases in Alloys.- 6.6 Intermetallics.- 6.7 Scope of the Chapter.- 6.8 SEM/EDX Characterization-General.- 6.8.1 Tin-Lead Solders.- 6.8.2 Two Percent Silver Solder.- 6.8.3 Gold-and Silver-Based Solders.- 6.8.4 Indium Solders.- 6.8.5 Bismuth Solders.- 6.8.6 Miscellaneous.- 6.9 Solderability Issues.- 6.9.1 Maintaining Solderability.- 6.9.2 Inadequate Tin Protective Coatings.- 6.9.3 The Dangers of "Forcing" Poor Solderability.- 6.10 Reliability Issues-Leaching of Substrate.- 6.11 Reliability Issues Gold Embrittlement.- 6.12 Reliability Issues-

Details zur Ausgabe

• Verlag: Springer
• Erscheinungsdatum: 2011
• ISBN 10: 1461539110
• ISBN 13: 9781461539117
• Einband: Paperback
• Sprache: Englisch
• Kontakt zum Hersteller: Nicht verfügbar