Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.
The book also includes exercises and detailed solutions at the end of each chapter.
Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.
Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also:
Reliability of Microtechnology is an ideal volume for researchers and professional engineers working in reliability and manufacturing. The book also includes exercises and detailed solutions at the end of each chapter.
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Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.The book also includes exercises and detailed solutions at the end of each chapter. 220 pp. Englisch. Bestandsnummer des Verkäufers 9781489982117
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Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Discusses the general failure mechanisms of microsystems on a component levelComprehensive coverage of solder joint reliability at the microsystems levelIncludes accelerated testing of solder joints at the microsystems levelDiscusses. Bestandsnummer des Verkäufers 11466536
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Taschenbuch. Zustand: Neu. Reliability of Microtechnology | Interconnects, Devices and Systems | Johan Liu (u. a.) | Taschenbuch | xiii | Englisch | 2014 | Springer | EAN 9781489982117 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. Bestandsnummer des Verkäufers 105057982
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Taschenbuch. Zustand: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.The book also includes exercises and detailed solutions at the end of each chapter. Bestandsnummer des Verkäufers 9781489982117
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Taschenbuch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.The book also includes exercises and detailed solutions at the end of each chapter.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 220 pp. Englisch. Bestandsnummer des Verkäufers 9781489982117
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