Die-stacking Architecture (Synthesis Lectures on Computer Architecture, Band 31) - Softcover

Xie, Yuan; Zhao, Jishen

 
9781627057653: Die-stacking Architecture (Synthesis Lectures on Computer Architecture, Band 31)
Softcover
ISBN 10: 162705765X ISBN 13: 9781627057653
Verlag: Morgan and Claypool Life Sciences, 2015

Inhaltsangabe

The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.

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Verlag
Morgan and Claypool Life Sciences
Erscheinungsdatum
2015
Sprache
Englisch
ISBN 10 
162705765X
ISBN 13 
9781627057653
Einband
Taschenbuch
Anzahl der Seiten
127
Kontakt zum Hersteller
Nicht verfügbar
Verantwortliche Person
Nicht verfügbar

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9783031006197: Die-stacking Architecture (Synthesis Lectures on Computer Architecture)

Vorgestellte Ausgabe

ISBN 10:  3031006194 ISBN 13:  9783031006197
Verlag: Springer, 2015
Softcover