Flexible and Stretchable Electronics - Softcover

Softcover

ISBN 10: 3038424366 ISBN 13: 9783038424369

Verlag: MDPI, 2017

Inhaltsangabe

Flexible and stretchable electronics are receiving tremendous attention as future electronics due to their flexibility and light weight, especially as applications in wearable electronics. Flexible electronics are usually fabricated on heat sensitive flexible substrates such as plastic, fabric or even paper, while stretchable electronics are usually fabricated from an elastomeric substrate to survive large deformation in their practical application. Therefore, successful fabrication of flexible electronics needs low temperature processable novel materials and a particular processing development because traditional materials and processes are not compatible with flexible/stretchable electronics. Huge technical challenges and opportunities surround these dramatic changes from the perspective of new material design and processing, new fabrication techniques, large deformation mechanics, new application development and so on. Here, we invited talented researchers to join us in this new vital field that holds the potential to reshape our future life, by contributing their words of wisdom from their particular perspective.

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Über die Autorinnen und Autoren

Seung Hwan Ko is currently a Professor in the Mechanical Engineering Department of Seoul National University, Korea. He received a B.S. in Yonsei University (2000), his M.S. in Seoul National University (2002), and a Ph.D degree in mechanical engineering at UC Berkeley in 2006. Before joining Seoul National University, he worked as a post-doctoral researcher at UC Berkeley (2006–2009) and an associate professor at KAIST (2009–2013). His research interest is in low temperature process development for flexible, stretchable and wearable electronics, laser assisted nano/micro fabrication process development, laser–nanomaterial interaction and crack assisted nanomanufacturing. He has published over 120 peer reviewed journal papers.

Daeho Lee is currently an Assistant Professor in the Department of Mechanical Engineering, Gachon University, Korea. He received a B.S. (2002) and M.S. (2007) in Seoul National University, a Ph.D degree in mechanical engineering at UC Berkeley in 2012. Before joining Gachon University, he worked as a visiting researcher at Lawrence Livermore National Lab (2013–2014) and as a post-doctoral fellow at UC Berkeley (2012–2014). His research interest is in flexible and stretchable electronics, optoelectronic devices, nanomaterials, low temperature laser processing.

Zhigang Wu is currently a Chutian scholar, distinguished professor in the School of Mechanical Science and Engineering, Huazhong University of Science and Technology (HUST), Wuhan. He received his PhD in Nanyang Technological University, Singapore. Before joining HUST, Dr. Wu was an Associate Professor in Microsystems Technology, Uppsala University, Sweden. His research focused on microscale mixing, flow visualization, soft material-based microprocessing technology and microfluidic devices and systems, especially cell separation chip design and development, as well as stretchable electronic systems.

Details zur Ausgabe

• Verlag: MDPI
• Erscheinungsdatum: 2017
• Sprache: Englisch
• ISBN 10: 3038424366
• ISBN 13: 9783038424369
• Einband: Taschenbuch
• Auflage: 1
• Anzahl der Seiten: 180
• Herausgeber: Hwan Ko Seung, Lee Daeho, Wu Zhigang
• Kontakt zum Hersteller: Nicht verfügbar
• Verantwortliche Person: preigu; mail@preigu.de; ; Lengericher Landstr. 19; Osnabrück; 49078; Deutschland