High-Bandwidth Memory Interface (SpringerBriefs in Electrical and Computer Engineering) - Softcover

Buch 45 von 209: SpringerBriefs in Electrical and Computer Engineering

Kim, Chulwoo

 
9783319023809: High-Bandwidth Memory Interface (SpringerBriefs in Electrical and Computer Engineering)
Softcover
ISBN 10: 3319023802 ISBN 13: 9783319023809
Verlag: Springer, 2013

Inhaltsangabe

This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.

Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.

Von der hinteren Coverseite

This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.

• Enables readers with minimal background in memory design to understand the basics of high-bandwidth memory interface design;
• Presents state-of-the-art techniques for memory interface design;
• Covers memory interface design at both the circuit level and system architecture level.

„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.

Verlag
Springer
Erscheinungsdatum
2013
Sprache
Englisch
ISBN 10 
3319023802
ISBN 13 
9783319023809
Einband
Taschenbuch
Anzahl der Seiten
96
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