High-Bandwidth Memory Interface (SpringerBriefs in Electrical and Computer Engineering) - Softcover

Kim, Chulwoo; Lee, Hyun-Woo; Song, Junyoung

Softcover

ISBN 10: 3319023802 ISBN 13: 9783319023809

Verlag: Springer, 2013

Inhaltsangabe

This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.

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This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.

• Enables readers with minimal background in memory design to understand the basics of high-bandwidth memory interface design;
• Presents state-of-the-art techniques for memory interface design;
• Covers memory interface design at both the circuit level and system architecture level.

Details zur Ausgabe

• Verlag: Springer
• Erscheinungsdatum: 2013
• Sprache: Englisch
• ISBN 10: 3319023802
• ISBN 13: 9783319023809
• Einband: Taschenbuch
• Anzahl der Seiten: 96
• Kontakt zum Hersteller: Springer Nature Customer Service Center GmbH; ProductSafety@springernature.com; ; Europaplatz 3; Heidelberg; 69115; Deutschland