This book contains extended and revised versions of the best papers presented at the 22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2014, held in Playa del Carmen, Mexico, in October 2014. The 12 papers included in the book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems.
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Buch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers presented atthe 22nd IFIP WG 10.5/IEEE International Conference on Very Large ScaleIntegration, VLSI-SoC 2014, held in Playa del Carmen, Mexico, in October 2014. The 12 papers included in the book were carefully reviewed and selected from the 33 full papers presented at the conference. The paperscover a wide range of topics in VLSI technology and advanced research. Theyaddress the current trend toward increasing chip integration and technologyprocess advancements bringing about stimulating new challenges both at thephysical and system-design levels, as well as in the test of these systems. 256 pp. Englisch. Bestandsnummer des Verkäufers 9783319252780
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Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented atthe 22nd IFIP WG 10.5/IEEE International Conference on Very Large ScaleIntegration, VLSI-SoC 2014, held in Playa del Carmen, Mexico, in October 2014. The 12 papers included in the book were carefully reviewed and selected from the 33 full papers presented at the conference. The paperscover a wide range of topics in VLSI technology and advanced research. Theyaddress the current trend toward increasing chip integration and technologyprocess advancements bringing about stimulating new challenges both at thephysical and system-design levels, as well as in the test of these systems. Bestandsnummer des Verkäufers 9783319252780
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Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book contains extended and revised versions of the best papers presented at the 22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2014, held in Playa del Carmen, Mexico, in October 2014. The 12 papers included in. Bestandsnummer des Verkäufers 67978443
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Buch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book contains extended and revised versions of the best papers presented at the 22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2014, held in Playa del Carmen, Mexico, in October 2014. The 12 papers included in the book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 256 pp. Englisch. Bestandsnummer des Verkäufers 9783319252780
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Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 256 | Sprache: Englisch | Produktart: Bücher | This book contains extended and revised versions of the best papers presented at the 22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2014, held in Playa del Carmen, Mexico, in October 2014. The 12 papers included in the book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems. Bestandsnummer des Verkäufers 26143384/2
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