Flexible Electronic Packaging and Encapsulation Technology - Hardcover

Hardcover

ISBN 10: 3527353593 ISBN 13: 9783527353590

Verlag: Wiley-VCH, 2024

Inhaltsangabe

Systematically introduces and summarizes the fundamental and experimental research results of recent progress on flexible electronic packaging and encapsulation technology.

Über diesen Titel

Über die Autorin bzw. den Autor

Prof. Hong Meng received his Ph.D. from University of California Los Angeles (UCLA) in 2002. He has been working in the field of organic electronics for more than 30 years. His career experiences including working at the Institute of Materials Science and Engineering (IMRE) in Singapore, Lucent Technologies Bell Labs, DuPont Experimental Station. In 2014, he moved to School of Advanced Materials at Peking University Shenzhen Graduate School. He has contributed over 230 peer-reviewed papers (citation: 11000) in chemistry and materials science fields, filed over 46 US patents, 140 Chinese patents.
Professor Wei Huang obtained his BSc, MSc and PhD from the Department of Chemistry, Peking University in 1983, 1988, and 1992, respectively. After teaching Physical Chemistry in Peking University from 1992 to 1993, he began his postdoctoral research with National University of Singapore (NUS) since 1995. In November 2011, he was elected as Academician of the Chinese Academy of Sciences (CAS). In April 2017, he was appointed as Deputy President & Provost of Northwestern Polytechnical University, China.

Von der hinteren Coverseite

A systematic introduction to the future of electronic packaging

Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential.

Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems.

Flexible Electronic Packaging and Encapsulation Technology readers will also find:

• Survey of commercial electronic packaging materials and patents for reference purposes
• Guidelines for designing high-performance packaging materials with novel structures
• An authorial team of leading researchers in the field

Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.

Details zur Ausgabe

• Verlag: Wiley-VCH
• Erscheinungsdatum: 2024
• Sprache: Englisch
• ISBN 10: 3527353593
• ISBN 13: 9783527353590
• Einband: Gebundene Ausgabe
• Auflage: 1
• Anzahl der Seiten: 384
• Herausgeber: Meng Hong, Huang Wei
• Kontakt zum Hersteller: Wiley-VCH GmbH; product_safety@wiley.com; ; Boschstrasse 12; Weinheim; 69469; Deutschland