Process Modeling of Chemical Mechanical Planarization: An Integrated Model from Abrasive Scale to Chip Scale; Basics, Characterizations, Modeling and Verification - Softcover

Choi, Jihong

 
9783639001662: Process Modeling of Chemical Mechanical Planarization: An Integrated Model from Abrasive Scale to Chip Scale; Basics, Characterizations, Modeling and Verification
Softcover
ISBN 10: 3639001664 ISBN 13: 9783639001662
Verlag: VDM Verlag Dr. Müller, 2008

Inhaltsangabe

Chemical Mechanical Planarization (CMP) is one of the key enabling technologies for modern IC fabrication. However, mainly due to the high complexities coming from various interactions among mechanical reactions and chemical reactions, its fundamental working mechanism is still not fully understood. This book summarizes key CMP applications and challenges in modern IC fabrication, and provides a comprehensive physical CMP process model that can be applied for process characterization, process optimization, consumable development, and layout design for manufacturing (DFM). The model has been built from an abrasive scale to a chip scale, focusing on practical application for DFM while also considering CMP process conditions as key input parameters. Also included are examples of a computer model application for pattern dependent variation in shallow trench isolation CMP and the model verification with specially designed test chip. The model should help CMP professionals, DFM engineers and students of IC fabrication obtain a fundamental understanding of CMP process and characterize and improve a process through real application.

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Verlag
VDM Verlag Dr. Müller
Erscheinungsdatum
2008
Sprache
Englisch
ISBN 10 
3639001664
ISBN 13 
9783639001662
Einband
Taschenbuch
Anzahl der Seiten
144
Kontakt zum Hersteller
Nicht verfügbar
Verantwortliche Person
Zeitfracht Medien GmbH
info-medien@zeitfracht.de

Ferdinand-Jühlke-Straße 7
Erfurt
99095
Deutschland