Verwandte Artikel zu Advanced Packaging For Microelectronic and Microsystem...

Advanced Packaging For Microelectronic and Microsystem Applications: With Emphasis on GaN Technology - Softcover

Anderson, Travis

 
9783639096767: Advanced Packaging For Microelectronic and Microsystem Applications: With Emphasis on GaN Technology
Softcover
ISBN 10: 3639096762 ISBN 13: 9783639096767
Verlag: VDM Verlag Dr. Müller, 2008

Inhaltsangabe

The emergence of GaN-based devices promises a revolution in areas requiring high performance electronics, such as high speed earth and space-based communication systems, advanced radar, integrated sensors, high temperature electronics, and utility power switching. The properties of this system make it ideally suited for operation at elevated temperatures and at voltage and current levels well beyond that accessible by Si. Recent improvements in material quality and device performance are rapidly opening the door to commercialization, and III-N technologies are demonstrating exciting developments of late. Though devices are entering commercialization, there are still considerable unknowns, particularly in the reliability field. Recent advances at the University of Florida will be detailed in this work.

Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.

Verlag
VDM Verlag Dr. Müller
Erscheinungsdatum
2008
Sprache
Englisch
ISBN 10 
3639096762
ISBN 13 
9783639096767
Einband
Taschenbuch
Anzahl der Seiten
116
Kontakt zum Hersteller
Scholars Press
customerservice@vdm-vsg.de

Brivibas gatve 197
Riga
1039
Lettland