Verwandte Artikel zu 3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme
Inhaltsangabe
"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D.
Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA.
Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.
Über die Autorin bzw. den Autor
Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U.A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA.
„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.
Neu kaufen
Diesen Artikel anzeigen
EUR 168,22
Gratis für den Versand innerhalb von/der Deutschland
Versandziele, Kosten & DauerSuchergebnisse für 3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme
Beispielbild für diese ISBN
3-Dimensional VLSI : A 2.5-Dimensional Integration Scheme
Anbieter: Buchpark, Trebbin, Deutschland
Verkäuferbewertung 5 von 5 Sternen
Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 200 | Sprache: Englisch | Produktart: Bücher. Bestandsnummer des Verkäufers 6133078/12
Anzahl: 1 verfügbar
Foto des Verkäufers
3-Dimensional VLSI
Anbieter: moluna, Greven, Deutschland
Verkäuferbewertung 5 von 5 Sternen
Gebunden. Zustand: New. A new integration scheme considering both performance and yieldNovel cost model to compare difference integration stylesDesign driven approach to prove the performance advantages of 2.5/3-D IC sFull EDA tool support for 3-D layout cr. Bestandsnummer des Verkäufers 5044221
Anzahl: 4 verfügbar
Foto des Verkäufers
3-Dimensional VLSI : A 2.5-Dimensional Integration Scheme
ISBN 10: 3642041566
ISBN 13: 9783642041563
Neu
Hardcover
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Verkäuferbewertung 5 von 5 Sternen
Buch. Zustand: Neu. Neuware - '3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme'elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D.Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA. Bestandsnummer des Verkäufers 9783642041563
Anzahl: 2 verfügbar
Beispielbild für diese ISBN
3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme
Anbieter: Lucky's Textbooks, Dallas, TX, USA
Verkäuferbewertung 5 von 5 Sternen
Zustand: New. Bestandsnummer des Verkäufers ABLIING23Mar3113020214534
Anzahl: 1 verfügbar
Beispielbild für diese ISBN
3-Dimensional VLSI: A 2.5-dimensional Integration Scheme
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
Verkäuferbewertung 5 von 5 Sternen
Hardcover. Zustand: Brand New. 200 pages. 9.25x6.00x0.50 inches. In Stock. Bestandsnummer des Verkäufers x-3642041566
Anzahl: 2 verfügbar
Beispielbild für diese ISBN
3-Dimensional VLSI (Hardcover)
ISBN 10: 3642041566
ISBN 13: 9783642041563
Neu
Hardcover
Anbieter: Grand Eagle Retail, Mason, OH, USA
Verkäuferbewertung 5 von 5 Sternen
Hardcover. Zustand: new. Hardcover. "3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D.Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA. "3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. Bestandsnummer des Verkäufers 9783642041563
Anzahl: 1 verfügbar