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Wafer Bonding: Applications and Technology (Springer Series in Materials Science, Band 75) - Softcover

Buch 62 von 233: Springer Series in Materials Science
 
9783642059155: Wafer Bonding: Applications and Technology (Springer Series in Materials Science, Band 75)
Softcover
ISBN 10: 3642059155 ISBN 13: 9783642059155
Verlag: Springer, 2011

Inhaltsangabe

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

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During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

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Verlag
Springer
Erscheinungsdatum
2011
Sprache
Englisch
ISBN 10 
3642059155
ISBN 13 
9783642059155
Einband
Taschenbuch
Anzahl der Seiten
524
Herausgeber
Alexe Marin, Gösele Ulrich
Kontakt zum Hersteller
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