The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includes modern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer’s view.
Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.
About the Author
The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includes modern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer’s view.
„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.
Anbieter: Books Puddle, New York, NY, USA
Zustand: New. 1st Edition. Bestandsnummer des Verkäufers 26396311101
Anzahl: 2 verfügbar
Anbieter: Brook Bookstore On Demand, Napoli, NA, Italien
Zustand: new. Questo è un articolo print on demand. Bestandsnummer des Verkäufers 4VM17POEHA
Anzahl: Mehr als 20 verfügbar
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
Zustand: New. Bestandsnummer des Verkäufers 401114594
Anzahl: 2 verfügbar
Anbieter: Romtrade Corp., STERLING HEIGHTS, MI, USA
Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide. Bestandsnummer des Verkäufers ABBB-24980
Anbieter: Basi6 International, Irving, TX, USA
Zustand: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service. Bestandsnummer des Verkäufers ABEOCT25-16115
Anbieter: Basi6 International, Irving, TX, USA
Zustand: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service. Bestandsnummer des Verkäufers ABEOCT25-275761
Anbieter: Biblios, Frankfurt am main, HESSE, Deutschland
Zustand: New. Bestandsnummer des Verkäufers 18396311095
Anzahl: 4 verfügbar
Anbieter: SMASS Sellers, IRVING, TX, USA
Zustand: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed. Bestandsnummer des Verkäufers SNTA-24980
Anbieter: Basi6 International, Irving, TX, USA
Zustand: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service. Bestandsnummer des Verkäufers ABEOCT25-302246
Anbieter: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Deutschland
Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching,doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includesmodern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer's view. 276 pp. Englisch. Bestandsnummer des Verkäufers 9783658410407
Anzahl: 2 verfügbar