Silicon Semiconductor Technology: Processing and Integration of Microelectronic Devices - Softcover

Hilleringmann, Ulrich

Softcover

ISBN 10: 365841040X ISBN 13: 9783658410407

Verlag: Springer-Verlag GmbH, 2023

Inhaltsangabe

The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includes modern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer’s view.

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About the Author

Prof. Dr.-Ing. Ulrich Hilleringmann has been teaching semiconductor technology, microelectromechanical systems, sensor technology and optoelectronic system integration since 1989.

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The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includes modern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer’s view.

The Content

• Wafer fabrication
• Thermal oxidation
• Lithography
• Etching technology
• Doping techniques
• Chemical and Physical Deposition
• Metallization and Contacts

About the Author

Prof. Dr.-Ing. Ulrich Hilleringmann has been teaching semiconductor technology, microelectromechanical systems, sensor technology and optoelectronic system integration since 1989

Details zur Ausgabe

• Verlag: Springer-Verlag GmbH
• Erscheinungsdatum: 2023
• Sprache: Englisch
• ISBN 10: 365841040X
• ISBN 13: 9783658410407
• Einband: Tapa blanda
• Auflage: 1
• Anzahl der Seiten: 276
• Kontakt zum Hersteller: Nicht verfügbar
• Verantwortliche Person: CMN Printpool Inh. Mathis Neumann; https://www.also.com/ec/cms5/en_6000/6000/index.jsp; ; Friedrich-Karl-Str. 9; Hamburg; Deutschland