Computational Heat Transfer Analysis of Electronic Equipments: Using Finite Element Analysis Approach - Softcover

Sharma, Sahil; Mehta, Nirajkumar; Mandalia, Jay

Softcover

ISBN 10: 6138836197 ISBN 13: 9786138836193

Verlag: Scholars' Press, 2019

Inhaltsangabe

Due to rapid research in the electronics industry, including a dramatic increase in chip densities and power densities, as well as a continuous decrease in physical dimensions of electronic packages, thermal management is, and will continue to be, one of the most critical areas in electronic product development. It will have a significant impact on the cost, overall design, reliability and performance. The present trend in the electronics industry is to reduce the size and increase the performance of the equipment. The cooling rate of the modern electronic component is one of the prime areas for the application of thermal control techniques. In the present book, the effect of various shapes of cross sections of fins on the motherboard is studied keeping the inlet air velocity, the temperature of the ambient and the heat generation constant. Finite Element Analysis is done to get heat transfer and temperature distribution. This book will be useful for researchers doing research on computational heat transfer specifically for the electronics industry.

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Über die Autorin bzw. den Autor

Sahil Sharma is a Graduate Mechanical Engineer of ITM Universe, Vadodara, Gujarat, India. Dr. Nirajkumar Mehta is an Associate Professor at ITM Universe, Vadodara, Gujarat, India. Prof. Jay Mandalia is Head of Mechanical Engineering Department at ITM Universe, Vadodara, Gujarat, India.

Details zur Ausgabe

• Verlag: Scholars' Press
• Erscheinungsdatum: 2019
• Sprache: Englisch
• ISBN 10: 6138836197
• ISBN 13: 9786138836193
• Einband: Taschenbuch
• Anzahl der Seiten: 60
• Kontakt zum Hersteller: Nicht verfügbar
• Verantwortliche Person: Verlag Unser Wissen; customerservice@vdm-vsg.de; ; Brivibas gatve 197; Riga; 1039; Lettland