Optimization of area and power of 3D integrated circuits: Optimization of Area and Power of Three-Dimensional Integrated Circuits (3D ICs) - Softcover

Lal, Roop; Raghuvanshi, Sakshi

 
9786200458964: Optimization of area and power of 3D integrated circuits: Optimization of Area and Power of Three-Dimensional Integrated Circuits (3D ICs)
Softcover
ISBN 10: 6200458960 ISBN 13: 9786200458964
Verlag: LAP LAMBERT Academic Publishing, 2019

Inhaltsangabe

Three-dimensional (3D) Integrated Circuits (ICs) has emerged as a new technology providing noticeable solutions to alleviate problems like greater power consumption, longer interconnects with large delays, etc. In 3D ICs, have multiple layers stacked one above the other. Vertical integration of multiple layers scales up the performance of electronic devices beyond Moore's law. It drastically decreases the interconnect length which directly results in increased speed and also combines various technologies (digital, analog, memory, etc.) in a single product, thereby greatly extending the capabilities of System-on-Chip. The objective of this book is to investigate the effects of core utilization on the core and chip area for obtaining the optimal sets of core utilization so that the core and chip area of the 3D ICs can be reduced. Cadence Encounter-to-GDSII has been used for optimization while performing physical designing of the 3D ICs. The literature survey has revealed that majority of the optimization has been performed only at any one of the stages of physical designing while in this book we have done research optimization at three different stages of physical designing.

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Über die Autorin bzw. den Autor

Dr. Roop Lal is presently working as Assistant Professor in the Mechanical Engineering Department, Delhi Technological University, Delhi. He has 17-years of experience in the aviation sector & over 20 years of teaching experience. Sakshi Raghuvanshi is Gold Medalist in her M.Tech (VLSI) and has secured the B.Tech with Honors.

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Verlag
LAP LAMBERT Academic Publishing
Erscheinungsdatum
2019
Sprache
Englisch
ISBN 10 
6200458960
ISBN 13 
9786200458964
Einband
Taschenbuch
Anzahl der Seiten
100
Kontakt zum Hersteller
Nicht verfügbar
Verantwortliche Person
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