The recent advances in wireless communication and semiconductor technology led to the miniaturization of circuits, increased bandwidth, and faster speed. In order to satisfy the enormous demand of low cost and smaller feature size, chips and transmission lines must be integrated within a constrained space in a printed circuit board which leads to signal integrity issues. Signal integrity is the measure of the quality of the electrical signal. The signal that travels in one interconnect will couple with the adjacent interconnects by means of electromagnetic coupling which may affect the timing and the quality of the signal. The most predominant signal integrity issue is a radiated emission. The unintentional release of electromagnetic energy from interconnects is called radiated emission. The significant source of radiated emission is a common mode current. The defective ground structure (DGS) is the right candidate to suppress common mode radiation on high speed printed circuit board.
Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.
Dr.M.Anandan, Assistant Professor of ECE Department of Vel Tech Rangarajan Dr. Sagunthala R&D Institute of Science and Technology, Chennai, obtained his B.E., degree from Madurai Kamaraj University, Madurai and M.E. degree from Anna University, Chennai. He has more than 10 years of Teaching experience. Completed Ph.D. in Anna University, Chennai.
„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.
Anbieter: PBShop.store US, Wood Dale, IL, USA
PAP. Zustand: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000. Bestandsnummer des Verkäufers L0-9786203589221
Anzahl: Mehr als 20 verfügbar
Anbieter: PBShop.store UK, Fairford, GLOS, Vereinigtes Königreich
PAP. Zustand: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000. Bestandsnummer des Verkäufers L0-9786203589221
Anzahl: Mehr als 20 verfügbar
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
Zustand: New. In. Bestandsnummer des Verkäufers ria9786203589221_new
Anzahl: Mehr als 20 verfügbar
Anbieter: Chiron Media, Wallingford, Vereinigtes Königreich
Paperback. Zustand: New. Bestandsnummer des Verkäufers 6666-IUK-9786203589221
Anzahl: 10 verfügbar
Anbieter: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Deutschland
Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The recent advances in wireless communication and semiconductor technology led to the miniaturization of circuits, increased bandwidth, and faster speed. In order to satisfy the enormous demand of low cost and smaller feature size, chips and transmission lines must be integrated within a constrained space in a printed circuit board which leads to signal integrity issues. Signal integrity is the measure of the quality of the electrical signal. The signal that travels in one interconnect will couple with the adjacent interconnects by means of electromagnetic coupling which may affect the timing and the quality of the signal. The most predominant signal integrity issue is a radiated emission. The unintentional release of electromagnetic energy from interconnects is called radiated emission. The significant source of radiated emission is a common mode current. The defective ground structure (DGS) is the right candidate to suppress common mode radiation on high speed printed circuit board. 64 pp. Englisch. Bestandsnummer des Verkäufers 9786203589221
Anzahl: 2 verfügbar
Anbieter: moluna, Greven, Deutschland
Kartoniert / Broschiert. Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Malaiarasan AnandanDr.M.Anandan, Assistant Professor of ECE Department of Vel Tech Rangarajan Dr. Sagunthala R&D Institute of Science and Technology, Chennai, obtained his B.E., degree from Madurai Kamaraj University, Madurai and M.E. Bestandsnummer des Verkäufers 472455569
Anzahl: Mehr als 20 verfügbar
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
Taschenbuch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The recent advances in wireless communication and semiconductor technology led to the miniaturization of circuits, increased bandwidth, and faster speed. In order to satisfy the enormous demand of low cost and smaller feature size, chips and transmission lines must be integrated within a constrained space in a printed circuit board which leads to signal integrity issues. Signal integrity is the measure of the quality of the electrical signal. The signal that travels in one interconnect will couple with the adjacent interconnects by means of electromagnetic coupling which may affect the timing and the quality of the signal. The most predominant signal integrity issue is a radiated emission. The unintentional release of electromagnetic energy from interconnects is called radiated emission. The significant source of radiated emission is a common mode current. The defective ground structure (DGS) is the right candidate to suppress common mode radiation on high speed printed circuit board.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 64 pp. Englisch. Bestandsnummer des Verkäufers 9786203589221
Anzahl: 1 verfügbar
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The recent advances in wireless communication and semiconductor technology led to the miniaturization of circuits, increased bandwidth, and faster speed. In order to satisfy the enormous demand of low cost and smaller feature size, chips and transmission lines must be integrated within a constrained space in a printed circuit board which leads to signal integrity issues. Signal integrity is the measure of the quality of the electrical signal. The signal that travels in one interconnect will couple with the adjacent interconnects by means of electromagnetic coupling which may affect the timing and the quality of the signal. The most predominant signal integrity issue is a radiated emission. The unintentional release of electromagnetic energy from interconnects is called radiated emission. The significant source of radiated emission is a common mode current. The defective ground structure (DGS) is the right candidate to suppress common mode radiation on high speed printed circuit board. Bestandsnummer des Verkäufers 9786203589221
Anzahl: 1 verfügbar
Anbieter: preigu, Osnabrück, Deutschland
Taschenbuch. Zustand: Neu. Suppression of Radiated Emission in High Speed Printed Circuit Board | Using Defected Ground Structure | Anandan Malaiarasan (u. a.) | Taschenbuch | Englisch | 2021 | LAP LAMBERT Academic Publishing | EAN 9786203589221 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu. Bestandsnummer des Verkäufers 120063583
Anzahl: 5 verfügbar