A Comprehensive Study on Heat Transfer in Electronic Cooling Systems: Flow optimization of heat sinks for different Al/Cu compositions - Softcover

Hanumanthrappa, Ramesha; K, Ananda G; R, Varun K

 
9786204740263: A Comprehensive Study on Heat Transfer in Electronic Cooling Systems: Flow optimization of heat sinks for different Al/Cu compositions
Softcover
ISBN 10: 6204740261 ISBN 13: 9786204740263
Verlag: LAP LAMBERT Academic Publishing, 2022

Inhaltsangabe

In electronic cooling applications, a TE cooler serves as a device for transporting heat away from a surface that has a temperature higher than the ambient temperature. Electronic devices such as PC processors generate a huge amount of heat during operation poses a great thermal management challenge because reliable operation temperature for electronic devices has to be maintained. In most cases, the maximum electronic device junction temperature needs to be held at less than 85°C for reliable operation. The maximum heat flow from a high-performance electronic package can be about 200 W and is still constantly increasing. Conventional passive cooling technologies using air or water as working fluid, such as the microchannel sink, cannot fully meet the heat dissipation requirement and active cooling methods should be applied. Due to the limited installation space in electronic packages, conventional bulk cooling systems are too big. TE coolers combined with air cooling or liquid cooling approach at the hot sideshow have great potential because of their small size, high reliability, and no noise.

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Über die Autorin bzw. den Autor

Dr. Ramesha Hanumanthrappa, Assistant Professor, Department of Mechanical Engineering, Visvesvaraya Technological University, Belagavi, India. His area of research interest is Heat Transfer in Cooling Techniques. He has published over 8 research articles in reputed Scopus Index Journals, and Web of Science.

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Verlag
LAP LAMBERT Academic Publishing
Erscheinungsdatum
2022
Sprache
Englisch
ISBN 10 
6204740261
ISBN 13 
9786204740263
Einband
Taschenbuch
Anzahl der Seiten
128
Kontakt zum Hersteller
Nicht verfügbar
Verantwortliche Person
Fastbook Publishing
customerservice@vdm-vsg.de

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