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Integrated circuit advanced packaging technology - Cu-Cu bonding technology(Chinese Edition)
Anbieter: liu xing, Nanjing, JS, China
Verkäuferbewertung 5 von 5 Sternen
Hardcover. Zustand: New. HardCover.Pub Date:2022-03-01 Pages:187 Language:Chinese Publisher:Higher Education Press Interconnect bonding in microelectronic packaging is a key and difficult link in the back-end manufacturing of integrated circuits (ICs). . which directly affects the physical properties of the integrated circuit itself. such as electrical properties. optical properties and thermal properties. and largely determines the miniaturization. functionalization. reliability and production cost of IC products. H. Bestandsnummer des Verkäufers NX045767
Neu kaufen
EUR 128,21
EUR 15,79 Versand
Versand von China nach USA
Versand von China nach USA
Anzahl: 1 verfügbar
Beispielbild für diese ISBN
Integrated circuit advanced packaging technology - Cu-Cu bonding technology(Chinese Edition)
Anbieter: liu xing, Nanjing, JS, China
Verkäuferbewertung 5 von 5 Sternen
Hardcover. Zustand: New. HardCover.Pub Date:2022-03-01 Pages:187 Language:Chinese Publisher:Higher Education Press Interconnect bonding in microelectronic packaging is a key and difficult link in the back-end manufacturing of integrated circuits (ICs). . which directly affects the physical properties of the integrated circuit itself. such as electrical properties. optical properties and thermal properties. and largely determines the miniaturization. functionalization. reliability and production cost of IC products. H. Bestandsnummer des Verkäufers AMZ036591_NX045767_036591
Neu kaufen
EUR 128,21
EUR 15,79 Versand
Versand von China nach USA
Versand von China nach USA
Anzahl: 3 verfügbar