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Microelectronics Wire Bonding (Original Book 3rd Edition)(Chinese Edition)
Anbieter: liu xing, Nanjing, JS, China
Verkäuferbewertung 5 von 5 Sternen
Hardcover. Zustand: New. Language:Chinese.HardCover.Pub Date:2022-06-01 Publisher:Machinery Industry Press Microelectronics Wire Bonding (3rd Edition) translated from Professor George Harman's book Wire Bonding in Microelectronics (3rd Edition) . systematically summarizes the development context and latest achievements of wire bonding technology in the past 70 years. and makes an outlook on the future development trend. The main contents include: ultrasonic bonding system and technology. metallurgical characteristics. Bestandsnummer des Verkäufers NX045985
Beispielbild für diese ISBN
Microelectronics Wire Bonding (Original Book 3rd Edition)(Chinese Edition)
Anbieter: liu xing, Nanjing, JS, China
Verkäuferbewertung 5 von 5 Sternen
Hardcover. Zustand: New. Language:Chinese.HardCover.Pub Date:2022-06-01 Publisher:Machinery Industry Press Microelectronics Wire Bonding (3rd Edition) translated from Professor George Harman's book Wire Bonding in Microelectronics (3rd Edition) . systematically summarizes the development context and latest achievements of wire bonding technology in the past 70 years. and makes an outlook on the future development trend. The main contents include: ultrasonic bonding system and technology. metallurgical characteristics. Bestandsnummer des Verkäufers AMZ065386_NX045985_065386