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High temperature resistant connection materials. processes and reliability of wide bandgap semiconductor devices(Chinese Edition)
Anbieter: liu xing, Nanjing, JS, China
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paperback. Zustand: New. Language:Chinese.Paperback. Pub Date: 2022-08-01 Pages: 248 Publisher: Mechanical Industry Press Traditional solder alloys have been widely used in the microelectronics industry. but solder alloys can no longer meet the third-generation wide bandgap High temperature application requirements for semiconductor (silicon carbide and gallium nitride) devices. The new silver sintering/copper sintering technology and transient liquid phase bonding technology are the key technologies to realize the r. Bestandsnummer des Verkäufers NY043160
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