Anbieter: liu xing, Nanjing, JS, China
paperback. Zustand: New. Language:Chinese.Paperback. Pub Date: 2023-08 Pages: 327 Publisher: China Machinery Press The main content of the book Heterogeneous Integration Technology involves the basic composition. technical system. process details and applications of heterogeneous integration technology. covering heterogeneous integration on organic substrates. heterogeneous integration on silicon substrates (TSV adapters. bridges). fan-out wafer-level/board-level packaging. fan-out RDL substrate heterogeneous integra. Bestandsnummer des Verkäufers DR007773
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