Suchergebnisse für 基于TSV的三维堆叠&...
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Design for testability and test optimization technology for 3D stacked integrated circuits based on TSV(Chinese Edition)
Anbieter: liu xing, Nanjing, JS, China
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paperback. Zustand: New. Language:Chinese.Paperback. Pub Date: 2024-06 Publisher: China Machine Press Testing is a method used to ensure the stability and effectiveness of integrated circuits. and is an indispensable and important means throughout all aspects of integrated circuit manufacturing. The particularity of the TSV-based 3D stacked integrated circuit structure and the variability of the design process bring new problems and challenges to the testing process. This book first discusses the basic concepts. basi. Bestandsnummer des Verkäufers DR007345
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