Multichip module technology handbook(Chinese Edition) - Softcover

(MEI) Philip E. Garrou, (MEI) Lwona Turlik ZHU

 
9787121022807: Multichip module technology handbook(Chinese Edition)

Inhaltsangabe

Language:Chinese.Soft cover.publisher:Electronic Industry Press.description:Paperback. Publisher: Electronic Industry Press. This book from the circuit design. material properties. process assembly. packaging. thermal design and test other aspects of comprehensive

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