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Three-dimensional integrated circuit manufacturing technology(Chinese Edition)
Anbieter: liu xing, Nanjing, JS, China
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Hardcover. Zustand: New. HardCover. Pub Date: 2022-08-01 Pages: 376 Language: Chinese Publisher: Electronic Industry Press At present. the feature size of integrated circuit devices is getting closer and closer to the physical limit. and integrated circuit technology has moved towards three-dimensional integration. improving performance/power consumption Compared with the development of new technology routes. Based on the development trend and technical route of global integrated circuit technology. combined with the. Bestandsnummer des Verkäufers NY043158
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