EUR 16,09 für den Versand von China nach USA
Versandziele, Kosten & DauerAnbieter: liu xing, Nanjing, JS, China
paperback. Zustand: New. Paperback. Pub Date: 2017-02-01 Pages: 447 Language: Chinese Publisher: chemical industry press The book written by flip chip package technology world-class specialist. and summarized the past more than ten years of flip chip packaging technology development and new achievements. and made a prospect of the future development trend.The content covers the flip chip market and technology. Bestandsnummer des Verkäufers DO043579
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