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Advanced Electronic Packaging Technology and Key Materials Series--Modeling and Simulation of Microelectronic Packaging and Integration (English version)(Chinese Edition)
Anbieter: liu xing, Nanjing, JS, China
Verkäuferbewertung 5 von 5 Sternen
Hardcover. Zustand: New. HardCover.Pub Date:2021-12-01 Pages:696 Language:English Publisher:Chemical Industry Press With the development of electronic packaging. electronic packaging has changed from the traditional four main functions (power system. signal distribution and transmission. heat dissipation and Mechanical protection) is expanded to six functions. namely. two new functions. DFX and system test. are added. Where DFX is designed for X. X includes: manufacturability. reliability. maintainability. cost. and . Bestandsnummer des Verkäufers AMZ012358_NX046087_012358
Neu kaufen
EUR 443,55
EUR 15,55 Versand
Versand von China nach USA
Versand von China nach USA
Anzahl: 3 verfügbar
Beispielbild für diese ISBN
Advanced Electronic Packaging Technology and Key Materials Series--Modeling and Simulation of Microelectronic Packaging and Integration (English version)(Chinese Edition)
Anbieter: liu xing, Nanjing, JS, China
Verkäuferbewertung 5 von 5 Sternen
Hardcover. Zustand: New. HardCover.Pub Date:2021-12-01 Pages:696 Language:English Publisher:Chemical Industry Press With the development of electronic packaging. electronic packaging has changed from the traditional four main functions (power system. signal distribution and transmission. heat dissipation and Mechanical protection) is expanded to six functions. namely. two new functions. DFX and system test. are added. Where DFX is designed for X. X includes: manufacturability. reliability. maintainability. cost. and . Bestandsnummer des Verkäufers NX046087
Neu kaufen
EUR 443,55
EUR 15,55 Versand
Versand von China nach USA
Versand von China nach USA
Anzahl: 1 verfügbar